Funded by University of Denver
In this project we use a top-down nano-precision technique based on single-mask standard fabrication process that allows low-cost and highly controlled batch fabrication and integration of silicon nanobeams within micro and nanoscale electromechanical systems on (100) silicon wafers. We are taking advantage of the crystalline structure of silicon to achieve extremely smooth sidewalls, sharp corners, and controllable feature size reduction. This technique works based on inducing a rotational misalignment between the photolithography defined patterns (with minimum features-size of 2µm) and the crystal orientation of the silicon substrate resulting in much narrower features (as small as 100nm) in the final structure.
- A. Rahafrooz, S. Pourkamali, “Controlled batch fabrication of crystalline silicon nanobeam-based resonant structures,” IEEE MEMS conference, 2011.